Join to apply for the Advance Packaging Engineer role at Piper Companies 14 hours ago Be among the first 25 applicants Join to apply for the Advance Packaging Engineer role at Piper Companies Piper Companies is seeking an Advanced Packaging Engineer to join the team at a high growth start up in Saratoga, CA. The ideal candidate for the Advanced Packaging Engineer role is a strategic thinker and hands-on engineer who can work to develop and integrate cutting-edge packaging solutions into complex systems. Responsibilities of the Advanced Packaging Engineer: Lead initiatives in advanced packaging technologies, with a focus on CoWoS and related high-density integration techniques. Wear multiple hats—technical leadership, cross-functional collaboration, and hands-on problem solving. Provide technical direction on 3D stacking and other emerging packaging technologies. Qualifications of the Advanced Packaging Engineer: Bachelor’s degree in Mechanical Engineering, Electrical Engineering, or related field. 15+ years of experience in advanced semiconductor packaging, with a proven track record of driving complex initiatives. Deep understanding of CoWoS and other high-performance packaging technologies. Strong system-level background, with experience integrating packaging into full electronic systems. Compensation for the Advanced Packaging Engineer: $190,000 - $270,000 annually with comprehensive benefits: Medical, Dental, Vison, 401k, PTO, holidays, sick leave as required by law This job opens for applications on 7/18/2025. Applications for this job will be accepted for at least 30 days from the posting date. Keywords: Advanced Packaging, CoWoS, TSMC, Semiconductor Packaging, System Integration, 3D Stacking, Packaging Solutions, Mechanical Engineering, Electrical Engineering, Materials Science, Hybrid Integration, IC Packaging, Heterogeneous Integration, Packaging Architecture, Cross-Functional Collaboration, Global Engineering Teams, Packaging Design, High-Density Interconnect, Thermal Management, Signal Integrity, Senior Engineer, Packaging Technology, Semiconductor Systems, Foundry Collaboration, Packaging Innovation
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